May 1 st is a holiday in many countries, but not in the U.S. And not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering of more than 2000 attendees at the 2018 TSMC Technology Symposium at the Santa Clara Convention Center. TSMC’s strategy to listen to market needs, analyze how best to meet the requirements and act accordingly demonstrated again how well this approach works. Here are highlights I captured out of the vast amount of business and technical information the TSMC speakers presented: In his introduction, David Keller, President of TSMC N.A., highlighted that the pace of innovation is accelerating, and more collaboration is needed to profit in a market with product life cycles getting as short as only six months. He stated that in 2017, North America was again TSMC’s largest market (71% of revenue, with over 5000 individual designs). Keller also outlined how TSMC applies technology leadership, design enablement and manufacturing excellence to serve their main markets: mobile, high-performance computing (HPC), automotive and internet of things (IoT) applications. Wei, TSMC President, and Co-CEO conveyed that (AI) and are the key drivers of our industry’s growth and reminded the audience that TSMC is committed to being a trusted technology and capacity partner. To demonstrate this commitment, Wei mentioned that TSMC employs more than 6000 research and development (R&D) experts and was first with 28, 16 and 10 nm as well as chip-on-wafer-on-substrate (CoWoS) and integrated fan-out (InFO) production. Snapper serial number year chart. Regarding capacity: TSMC shipped 11 Million 12“-equivalent wafers and will increase CapEx by $1B to $12B in 2018. VP Technology R&D, focused his talk on the speed, area/cost, and power benefits N7, N7+ and N5 bring to customers. This is the second of two posts about last week's TSMC Technology Symposium. Dinamalar epaper tamil. The first was yesterday and covered the big picture presented in the morning. It's a good job TSMC doesn't do countdowns for rocket launches. Bangalore, INDIA and Campbell, California, 22nd June, 2012:- Cosmic Circuits will be attending the TSMC Symposium held on 25th June at Tel Aviv, Israel. Cosmic Circuits offers a broad portfolio of differentiated Analog, Mixed-signal and connectivity IP cores in nanometer technology nodes. For example, N7 is 35% faster or 65% lower power, compared to N16 FF+. Also, N5 will be 15% faster, versus N7. Mii also stated that TSMC uses extreme ultraviolet (EUV) lithography in production today and will deploy multi-layer EUV for N7+ and N5. Mii also outlined several ongoing development projects: Replacing the fin in FinFETs with several vertically stacked nanowires, enabling an all-around gate. MRAM, RRAM, and PCRAM development projects will be completed. Ultra-low power processes, e.g. N12 ultra-low power (ULP) and ultra-low leakage (ULL) are in progress to serve IoT and mobile applications. ![]() With bipolar CMOS-DMOS (BCD), gallium nitride (GaN) and silicon carbide (SiC) technologies, TSMC will serve high voltage applications. Last, but certainly not least for 3D InCites readers, Mii hinted that larger interposer will become available in early 2019 and other advances in IC packaging technologies will be detailed by Doug Yu in the afternoon. Cliff Hou, VP Design and Technology Platform, focused on the availability of intellectual property (IP), electronic design automation (EDA) tools and design methodologies. Hou showed many slides detailing IP availability of IP and qualification status of design tools from Ansys, Cadence, Mentor, and Synopsys. Hou explained why N7+ is 20% denser and 10% lower power than N7 and announced a porting methodology to N7+.
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